学术论文

      Modeling, simulation and parametric optimization of wire EDM process using response surface methodology coupled with grey-Taguchi technique

      In the present work, quadratic mathematical models have been derived to represent the process behavior of wire electrical discharge machining (WEDM) operation. Experiments have been conducted with six process parameters: discharge current, pulse duration, pulse frequency, wire speed, wire tension and dielectric flow rate; to be varied in three different levels. Data related to the process responses viz. material removal rate (MRR), roughness value of the worked surface (a measure of surface finish, SF) and kerf have been measured for each of the experimental runs; which correspond to randomly chosen different combinations of factor setting. These data have been utilized to fit a quadratic mathematical model (Response Surface Model) for each of the responses, which can be represented as a function of the aforesaid six process parameters. Predicted data have been utilized for identification of the parametric influence in the form of graphical representation for showing influence of the parameters on selected responses. Predicted data given by the models (as per Taguchi’s L27 (3*6) Orthogonal Array (OA) design) have been used in search of an optimal parametric combination to achieve desired yield of the process: maximum MRR, good surface finish (minimum roughness value) and dimensional accuracy of the product. Grey relational analysis has been adopted to convert this multi-objective criterion into an equivalent single objective function; overall grey relational grade, which has been optimized (maximized) by using Taguchi technique. Optimal setting has been verified through confirmatory test; showed good agreement to the predicted value. This indicates utility of the grey-Taguchi technique as multi-objective optimizer in the field of wire EDM.
      作者: Saurav Datta Siba Sankar Mahapatra
      期刊: International Journal of Engineering, Science and Technology
      年,卷(期): 2011, 2(5)