SiC particles reinforced Al matrix composites with three different SiC volume fractions of 40%, 56% and 63% for elec-tronic packaging were prepared by pseudo-semi-solid thixoforming. The Al and SiC distribution and the fractographs of the SiCp/Al electronic packaging materials were examined by optical microscopy and scanning electron microscopy. The density, relative density, thermal conductivity ( TC) , coefficient of thermal expansion ( CTE) , compressive strength and bending strength of the SiCp/Al elec-tronic packaging materials were tested. It is found that the SiCp/Al electronic packaging materials have controllable coefficients of ther-mal expansion and high relative density. The Al matrix is connected into a network, and SiC particles are uniformly distributed in the Al matrix. When the SiC volume fraction increases, the density and thermal conductivity at room temperature lightly increase, the coef-ficient of thermal expansion gradually decreases, and the compressive strength and bending strength increase. The main fracture mode of the SiC/Al electronic packaging materials is brittle fracture of SiC particles accompanied by ductile fracture of the Al matrix at the same time.